Challenges For a Post-Moore's Law World
By Ed Sperling, Semiconductor Engineering
Semiconductor Engineering sat down to discuss challenges at the edge, the impact of open-source, and how to attract new talent, with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The conversation was part of the ESD Alliance’s annual outlook, which this year was held virtually. (Part 1 of this discussion is here. Part 2 is here. )
There is lot of innovation in the package. From a reliability and a security standpoint, the riskiest part of the supply chain is the assembly portion, because now you have an individual die moving throughout the supply chain with much less traceability. We’ve been working with SEMI on standards for traceability, particularly around the assembly flow, and for leveraging ledger technology like blockchain for logging what happens with material as it moves through that part of the supply chain.
But we have not articulated what is the driver for our industry today, as we did for a long time with Moore’s Law. And going around saying this law is dead without saying, ‘Here’s the new king,’ does turn off people. We should do something about that.