New Design Approaches At 7/5nm
By Ed Sperling, Semiconductor Engineering
The race to build chips with a multitude of different processing elements and memories is making it more difficult to design, verify and test these devices, particularly when AI and leading-edge manufacturing processes are involved.
“With AI, it’s not just silicon—it’s also software,” said Raik Brinkmann, CEO of OneSpin Solutions. “You can measure what’s going on with the training set, but you have limited visibility into how the network will interpolate from that. So two chips may still perform in a similar way, but they might not be at the same accuracy. The big question here is whether it is accurate enough.”